Business News
Silicon Box Ships 100M Units, Proves Advanced Panel-Level Packaging Ready for AI, HPC era
Oct 15, 2025
Singapore, October 15: Silicon Box, a global leader in chiplet integration and advanced semiconductor packaging, announced it has shipped 100-million-units from its flagship factory in Singapore's Tampines Wafer Park. The state-of-the-art facility, which began mass production in late 2023, produces advanced panel-level packaging (PLP) exclusively and is the largest of its kind globally in terms of production capacity. Silicon Box's proprietary technology is able to support chiplet integration by addressing challenges in performance, scalability and costs in wafer-level and traditional packaging schemes.
Read More..
